5月9日:Large-Area Micro and Nanofabrication through Nanoimprint

  题目Large-Area Micro and Nanofabrication through Nanoimprint 

  报 告 人:程鑫  南方科技大学 

  报告时间:201659日下午16: 00 

  报告地点:化物楼三楼会议室

    报告摘要:  

  Nanoimprint lithography is a pattern replication technique that bases on the mechanical forming of soft or liquid materials at the nanoscale. Since its inception, nanoimprint has attracted wide-spread interests due to its ultra-high resolution (sub-10 nm), low cost, simple equipment setup, and simple processing steps. In this talk, the basic principles, current developments, and future prospects of the nanoimprint technique are discussed. To overcome the limitations of conventional nanoimprint, new nanoimprint schemes and materials are developed by our group to expand its application scope, particularly for commercial application where large-area micro- and nanostructures are needed. As a general lithography technique, nanoimprint can be used to fabricate structures and devices for a wide range of applications, such as microelectronics, opt-electronics, photonics and bioengineering. Applications of nanoimprint in microfluidics, nanophotonics and organic electronics will be briefly discussed in this talk. 

  报告人简介 

  

 
Xin Cheng joined the Department of Materials Science and Engineering at South University of Science and Technology of China as a full professor in 2013. He received BS degree in Geochemistry from University of Science and Technology of China in 1997, MS degree in Geochemistry from Stanford University in 1999, and PhD degree in Electrical Engineering from the University of Michigan at Ann Arbor in 2005. He joined Texas A&M University (TAMU) as an assistant professor in the Department of Electrical and Computer Engineering in 2006, and became an Associate Professor in 2012.  

  His research interests include several basic and applied areas: 1) high-resolution lithographic techniques, particularly nanoimprint, and 3D micro- and nanofabrication techniques; 2) electronic and photonic devices based on new semiconductors and functional materials; and 3) integrated macroelectronic systems.   

  Dr. Cheng was the recipient of the NSF CAREER Award and the DARPA Young Faculty Award, both in 2011. In 2012, he was selected in the Recruitment Program of Global Experts (Young Scholar Program) by the Organization Department of the CCCPC.  

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